This six-layer high-frequency hybrid PCB with metal edges delivers superior performance for demanding applications. By integrating advanced materials like Rogers RO4350B, S1000-2M, FR-4, and TG170, it ensures minimal signal loss and exceptional stability in high-frequency environments.

The metal-edged design enhances durability and provides reliable EMI shielding for cleaner signal transmission. With ENIG surface treatment, the board offers improved corrosion resistance and solderability.

Precision-engineered with 0.25mm micro-vias and 5/5mil trace width/spacing, it enables high-density layouts and greater integration. Tight impedance control and 35μm copper thickness ensure efficient power delivery and signal integrity. Ideal for 5G, aerospace, and automotive applications, this PCB provides a robust foundation for high-performance electronics.