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HDI PCB Manufacturing Capability
🔌 HDI PCB Manufacturing Capabilities | 30-Layer ELIC HDI Board Fabrication
Superb delivers advanced HDI (High-Density Interconnect) PCB manufacturing solutions, supporting up to 30-layer ELIC (Every Layer Interconnect) structures with ultra-fine features. Production ensures superior electrical performance and high-density routing for AI modules, automotive electronics, and communication devices.
📊 HDI Parameter Table (2026)
| Parameter | Value |
|---|---|
| Max. Layer counts | ≤30 L ELIC |
| Max. Production size (mm) | 540 × 620 |
| Board thickness (mm) | 0.2 – 4.0 |
| Min. core thickness (mm) | 0.05 |
| Min. laser hole diameter / pad (mm) | 0.05 / 0.15 |
| Min. mech. hole diameter / pad (mm) | 0.15 / 0.30 |
| Min. line width / spacing (mm) | 0.035 / 0.035 |
| BGA Pitch (mm) | 0.3 |
| Copper thickness (oz) | 1 |
| Misalignment of layers (mm) | ±0.06 |
| Blind hole depth ratio | 1:1 |
| Through hole thickness / diameter ratio | 6:1 |
| Hole filling depression (μm) | ≤8 |
| Warpage | ≤0.5% |
| Solder resist | ±5% |
| PTH Tolerance (mm) | ±0.075 |
| NPTH Tolerance (mm) | ±0.05 |
| Press Fit Hole tolerance (mm) | ±0.05 |
| Slot Hole tolerance (mm) | ±0.1 |
| Outline tolerance (mm) | ±0.1 |
📡 Applications
AI ModulesAutomotive ElectronicsCommunication Devices
PCB
Contact Us
Superb Automation Co., Limited
Website:www.superb-tech.com
For 25 years your reliable partner in Electronics & PCBA!
HK number: 85260404363
Email :Info@superb-tech.com
Whatsapp:8613396081443