Component Incoming Inspection
Any failure in steps 1–3 triggers immediate lot rejection without further inspection.
| Severity | Code | Defect Examples | AQL | Action |
|---|---|---|---|---|
| Critical | CR | Wrong part number, counterfeit, refurbished, polarity reversed | 0 | Single defect → lot rejected |
| Major | MA | Oxidized leads, cracks, illegible marking, bent pins, solderability failure | 0.65 | Exceed → lot rejected |
| Minor | MI | Tilted label, minor cosmetic scuffs | 1.5 | Accept within limit, record |
| Equipment | Inspection / Measurement | Pass Criteria |
|---|---|---|
| LCR Meter | R, C, L, ESR, Q | Within ±1% / ±5% tolerance |
| Digital Multimeter | Diode Vf, shorts/opens, pin impedance | Matches golden sample or datasheet |
| Microscope (50–200×) | Marking quality, surface, leads/balls | No sanding, no residue, crisp marking |
| X-Ray | Die, bond wires, voiding | Matches golden reference; void ≤25% per ball |
| C-SAM | Delamination, cracks | No significant red/yellow areas |
| Solderability Tester | Wetting area, angle | ≥95% coverage, angle < 90° |
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