Advanced PCB Manufacturing Process

Precision Engineering for Next-Generation Electronics

Precision Manufacturing & Superior Quality

From engineering design (DFM) to final delivery, our production and testing processes are fully digitalized for end-to-end monitoring. With advanced process technology and comprehensive testing methods, we provide solid quality assurance for your products from prototyping to mass production.

For more information, contact our specialists:
pcb@superb-tech.com

PCB Process & Testing Workflow

We've organized the production process into 6 core stages based on manufacturing logic, making it easier to understand the full lifecycle of PCB production and quality control.

Stage 1: Pre-Production Preparation

Process Name	Main Purpose	Instruments & Processes
Pre-production Engineering	Review design documents and determine process parameters	Manual review of design documents to confirm compliance with manufacturing capabilities CAM software to check integrity and accuracy of design data

Stage 2: Inner Layer Circuit Fabrication

Process Name	Main Purpose	Instruments & Processes
Inner Layer Imaging	Accurately transfer circuit patterns onto inner-layer boards	AOI equipment: Compare with standard patterns to verify circuit integrity and accuracy
Etching	Remove unnecessary copper foil to form precise circuits	AOI equipment: Detect over-etching/under-etching Metallographic microscope: Confirm copper layer thickness
Photoresist Stripping	Completely remove residual photoresist	Visual inspection to confirm no photoresist residue remains
Inspection & Post-Etch Punch	Inspect circuit quality and complete positioning holes	AOI equipment: Recheck for circuit defects Hole diameter and position measuring instruments
Alternative Oxide Coating	Form uniform anti-oxidation coating on copper surfaces	Film thickness gauge: Measure coating thickness Surface roughness tester: Detect coating roughness

Stage 3: Lamination & Drilling

Process Name	Main Purpose	Instruments & Processes
Lamination	Bond multi-layer materials under high temperature and pressure	X-ray inspection: Detect internal air bubbles and alignment Hardness tester: Measure board structural stability
Drilling	Drill vias and mounting holes per design requirements	Hole diameter and position measuring instruments Microscope: Observe hole wall quality

Stage 4: Outer Layer Circuit Fabrication

Process Name	Main Purpose	Instruments & Processes
Metallization of the Dielectric	Deposit metal layer on hole walls for electrical conduction	Metallographic microscope: Observe metal layer thickness Micro-ohmmeter: Measure resistance of hole metal layer
Outer Layer Imaging	Accurately transfer outer-layer circuit patterns	AOI equipment: Check pattern transfer accuracy and alignment
Copper Plating	Uniformly plate copper layer on board surface and holes	Film thickness gauge: Measure copper plating thickness Hull cell test: Evaluate plating solution performance
Photoresist Stripping	Remove photoresist from outer-layer circuits	Visual inspection to confirm no residue remains
Final Etching	Precisely etch to form final outer-layer circuit	AOI equipment: Check for short circuits and open circuits Metallographic microscope: Verify circuit cross-section
Tin Stripping	Remove protective tin layer from circuits	Visual inspection to confirm complete removal

Stage 5: Surface Treatment & Marking

Process Name	Main Purpose	Instruments & Processes
Solder Mask Application	Apply solder mask layer and expose pads	AOI equipment: Check coverage and pad exposure Film thickness gauge: Measure solder mask thickness
Surface Finish	Improve solderability and anti-oxidation performance	Film thickness gauge: Measure surface treatment layer Contact angle measuring instrument: Detect wettability
Silkscreen	Print clear characters, logos, or part numbers	Visual inspection: Check clarity and integrity Magnifying glass: Verify edge neatness

Stage 6: Electrical Test & Shaping

Process Name	Main Purpose	Instruments & Processes
Electrical Test	Verify PCB electrical performance	Flying probe tester: For small-batch/prototype testing Bed-of-nails tester: For mass production testing
Routing & V-Scoring	Cut boards into finished products	Calipers: Measure board dimensions Microscope: Check cut edge quality

Why Choose Our PCB Manufacturing?

• Full Digital Monitoring: Every process is tracked digitally, ensuring complete traceability of quality data
• Multi-Level Quality Checks: AOI, microscopic inspection, and electrical testing integrated at each stage to prevent defects
• Professional Equipment: Advanced instruments including X-ray inspection and flying probe testers guarantee precision
• Expert Engineering Support: Our team provides technical consultation from design to production

For custom PCB solutions or technical consultations:
pcb@superb-tech.com