Language:
Superb PCB Manufacturing Process & Control Standards
From Gerber to Shipment · Every Step Defined and Controlled
This document outlines the complete PCB production workflow, the purpose of each step, key inspection points, methods, and acceptance criteria. All processes comply with IPC standards and customer-specific requirements.
| Process Stage | Abbr. | What is done | Why needed | Key inspections | Method / Equipment | Acceptance benchmark |
|---|---|---|---|---|---|---|
| Customer provides data | Gerber | Customer supplies Gerber, drill, outline, solder mask, legend data | Factory must know exactly what to build | File completeness, layer count, hole size, outline clarity | CAM engineering review, file import check | Matches customer Gerber, drill files, specification sheet |
| Engineering questions | EQ | Factory asks for clarification on unclear, risky, or contradictory data | Prevent misinterpretation and avoid wrong boards | Board thickness, copper thickness, impedance, drill feasibility, surface finish | Engineering review, DFM analysis, CAM compare | Based on customer confirmed answers and final execution requirements |
| CAM engineering | CAM | Convert design data into production‑ready files (compensation, panelization, drill tapes, films) | Design data must be adapted for manufacturing | Compensation logic, panel layout, drill data match, layer consistency | CAM software, engineering verification | Matches Gerber + EQ confirmation + factory process rules |
| Inner layer cutting | Cutting | Cut base material to production panel size | Prepare material for inner layer processing | Material type, dimensions, copper weight, surface condition | Incoming material check, dimension check | Matches customer required material, thickness, copper weight |
| Inner layer imaging | Inner Layer | Form circuit pattern on inner copper foil, etch away unwanted copper | Multi‑layer boards need inner circuits before lamination | Trace width, spacing, open, short, residual copper, notches | AOI, visual inspection, measurement | Matches Gerber pattern, process tolerance, IPC standards |
| Inner layer inspection | AOI | Automated optical inspection of inner layer patterns | Catch defects like open, short before lamination | Open, short, notches, burrs, pattern distortion | AOI equipment | Matches design pattern data |
| Lamination | Lamination | Press inner layers, prepreg and copper foil into a single multilayer board | Form the complete multilayer structure | Thickness, layer bonding, delamination, voids, warpage | Thickness measurement, microsection, visual | Matches stackup, total thickness, tolerance requirements |
| Drilling | Drilling | Drill through holes, mounting holes, tooling holes per data | Holes are essential for component mounting and interlayer connection | Hole size, position, offset, burrs, damage to inner pads | Drilling machine, hole position check, first article | Matches drill file, hole size tolerance, position tolerance |
| Plated Through Hole | PTH | Deposit copper on hole walls to make them conductive | Without continuous copper, current cannot flow between layers | Copper thickness in hole, continuity, voids, cracks, adhesion | Microsection, microscope, thickness gauge | Matches customer requirements, IPC-6012 standards |
| Outer layer imaging | Outer Layer | Form final outer circuit pattern on PCB surface | Outer circuits define final functional connectivity | Trace width, spacing, short, open, pad integrity | AOI, visual, measurement | Matches outer layer Gerber data and process tolerance |
| Solder mask | SM | Apply solder mask (green/black etc.) over non‑solder areas, expose pads | Prevent shorts, oxidation, contamination, improve insulation | Mask misregistration, exposed copper, mask on pads, bubbles, debris, adhesion | Visual, alignment check, adhesion test | Matches solder mask opening drawing, color requirement, IPC standard |
| Silkscreen / Legend | Silkscreen | Print component identifiers, logo, orientation marks, part number | Facilitate assembly, identification, repair | Wrong print, clarity, ink on pads | Visual inspection | Matches legend layer file |
| Surface finish | ENIG / HASL / OSP etc. | Apply final finish on pads (immersion gold, HASL, OSP, immersion tin) | Prevent oxidation, ensure solderability | Uniformity, discoloration, roughness, pad integrity | Visual, thickness measurement, solderability test | Matches customer specified surface finish and process standards |
| Routing / V-CUT | Routing | Mill panel into final customer board shape | Ensure board fits into customer assembly | Length, width, slots, edge burrs, contour consistency | Routing machine, V‑cut machine, caliper, 2.5D measurement | Matches outline drawing, dimension drawing, tolerance |
| Electrical test | E‑Test | Test that nets are connected as designed and isolated where required | Verify basic electrical function of the PCB | Open, short, wrong connection | Flying probe, fixture test | Matches netlist, Gerber data |
| Final visual inspection | FQC / OQC | Thorough visual check before shipment | Prevent obvious defects reaching customer | Scratches, exposed copper, contamination, warpage, legend defects, mask anomalies | Visual, magnifier, flatness check | Matches IPC‑A‑600, customer appearance requirements |
| Microsection analysis | Microsection | Cut and polish a small sample to observe internal structure | Detect issues invisible from outside | Layer misregistration, hole copper thickness, cracks, inner ring integrity, delamination | Cut, polish, microscope | Matches IPC, customer, process specifications |
| Solderability test | Solderability | Verify that pads can be easily wetted by solder | Ensure customer assembly does not suffer from poor wetting or non‑wetting | Solder coverage, wetting angle, non‑wetting, dewetting | Dip test, microscope, solderability tester | Matches solderability standards, customer assembly requirements |
| Shipment report | COC / QA report | Compile key test results into document for customer | Prove that the batch has been inspected and conforms | Thickness, dimensions, microsection, hole copper, visual, e‑test, solderability | Inspection record summary, report generation | Matches customer order requirements, inspection standards, final pass judgement |
All processes are subject to internal audits and continuous improvement. For special requirements, additional inspections or sampling plans can be applied.
PCB
Contact Us
Superb Automation Co., Limited
Website:www.superb-tech.com
For 25 years your reliable partner in Electronics & PCBA!
HK number: 85260404363
Email :Info@superb-tech.com
Whatsapp:8613396081443