Language:
PCBA Manufacturing Process
At SUPERB AUTOMATION, our manufacturing process follows strict standards with full-process quality control (IQC/IPQC/QA) to ensure product reliability, matching the professional workflow in our production system. IQCComprehensive incoming quality check for all materials (PCBs, components, solder paste). Precision printing of solder paste on PCB pads using automated stencil printers. Automated high-speed placement machines (HMT) for SMD components (resistors, capacitors, ICs). 12-zone reflow oven with nitrogen protection to prevent oxidation. IPQCFirst Article Inspection (FAI) to confirm process stability; Combination of automated insertion (for standard through-hole components) and manual insertion (for special connectors). Lead-free wave soldering with nitrogen protection to ensure solder joint quality. Initial functional test to verify basic electrical performance (voltage, current, signal continuity). Accelerated life test under high-temperature (40-60°C) and full-load conditions for 24-168 hours. Comprehensive functional test covering all product specifications (performance, communication, interface). Ultrasonic cleaning to remove flux residues and contaminants; QAFinal quality audit before packaging; Strict inspection of all incoming materials to prevent defective parts from entering production, including X-Ray component counting and DFM review. Real-time monitoring at key processes (printing, reflow, wave soldering) with first article inspection and C-CHART statistical process control. 100% final inspection before packaging and shipping, ensuring all products meet specifications and providing full traceability records.Full Production Workflow
1Material Preparation
Key actions: X-Ray counting (99.99% accuracy) for components, DFM design review, and humidity control storage for sensitive parts.2SMT - Solder Paste Printing
Control standards: 3D SPI (Solder Paste Inspection) to verify paste height, volume, and alignment (100% inspection rate).3SMT - Component Mounting
Special handling: BGA/CSP components with vision alignment to ensure placement accuracy (±0.02mm).4SMT - Reflow Soldering
Pre-treatment: PCB baking (80°C/4h) for moisture-sensitive PCBs to avoid popcorning during soldering.5SMT - Inspection (First Article & 100%)
100% inspection via AOI (Automated Optical Inspection) + X-Ray (for BGA hidden solder joints) to detect defects.6DIP - Component Insertion
Pre-inspection: Visual check of component orientation and insertion depth.7DIP - Wave Soldering
Post-soldering: Online AOI to check solder bridges, cold joints, and missing solder.8Pre-Test
Test stations: Dedicated fixtures for different product models to ensure test efficiency.9Burn-In Test
Purpose: Screen out early-failure components and ensure long-term reliability.10Final Test (F-TEST)
Inspection rate: 100% QA inspection to ensure no defective products enter packaging.11Cleaning & Touch-Up
Manual touch-up for minor defects (solder bridges, cold joints) by certified technicians.12Packaging (QA)
Customized ESD packaging with humidity control, and full traceability labels (batch number, production date, test results).Process Comparison (SUPERB vs Industry Average)
Stage
SUPERB Process (Matching PPT Workflow)
Industry Average
Core Advantage
Material Prep & IQC
Eliminates 95% of material-related issues
SMT (Print-Mount-Reflow)
SMT defect rate < 0.1% (industry: 0.5-1%)
Testing (Pre/Burn-In/Final)
Field failure rate reduced by 80%
Packaging & Shipping
Transit damage rate < 0.05%
Full-Process Quality Control
IQC (Incoming Quality Control)
IPQC (In-Process Quality Control)
QA (Final Quality Assurance)
Contact Us
Superb Automation Co., Limited
Website:www.superb-tech.com
For 25 years your reliable partner in Electronics & PCBA!
HK number: 852 4459 0634
Email :Info@superb-tech.com
Whatsapp:8613396081443