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Superb PCB Acceptance & Outgoing Quality Standards
Before shipment, every PCB batch must pass a predefined set of tests and visual checks. The table below lists each report item, its inspection purpose, what is actually measured, and what a passing result guarantees for your assembly.
Outgoing Inspection Report Items
| Report Item | Inspection Purpose | What is checked | Passing means |
|---|---|---|---|
| Board Thickness | Verify thickness meets design | Total board thickness within tolerance | Board fits enclosure, no assembly interference |
| Dimensions | Verify length, width, slots, holes | Length, width, hole positions, slot size, edge distance | Board mounts correctly, no alignment issues |
| Microsection | Inspect internal structure quality | Layer shift, hole copper thickness, wall integrity, delamination | Internal connections are reliable, not just surface good |
| Plated Copper in Hole | Verify conductive layer on hole wall | Copper continuity, thickness, cracks | Current flows reliably between layers |
| E-Test Result | Verify continuity and isolation | Open, short, wrong connection | Basic electrical function is correct |
| Visual Inspection | Ensure appearance meets delivery standard | Scratches, exposed copper, contamination, mask/legend defects | Cosmetically acceptable, no workmanship issues |
| Solderability Test | Confirm pads can be soldered easily | Wetting coverage, angle, non‑wetting, dewetting | SMT or hand soldering will not have wetting problems |
| Surface Finish Check | Verify pad surface condition | Uniformity, discoloration, roughness of ENIG/HASL/OSP | Pads are oxidation‑free, solderability guaranteed |
| Warp & Twist | Verify board flatness | Bow and twist measurement | No component lifting, no soldering defects, fits assembly |
What Each Inspection Method or Abbreviation Means
| Item / Abbr. | Full Name | What it does / Finds |
|---|---|---|
| Microsection | Cross‑section analysis | Cuts and polishes a sample to reveal layer alignment, hole copper thickness, cracks, delamination – detects internal defects invisible to X‑ray |
| E‑Test | Electrical Test | Tests all nets for open circuits, shorts, and wrong connections using flying probe or fixture |
| AOI | Automated Optical Inspection | Compares circuit pattern against design data to find broken traces, shorts, notches, residual copper |
| X‑Ray | X‑Ray Inspection | Looks at hidden structures (e.g., layer shift, BGA voiding, inner layer registration) non‑destructively |
| Solderability Test | Solderability (Dip & Wetting) Test | Checks pad wetting quality to ensure reliable assembly soldering |
| FQC / OQC | Final / Outgoing Quality Control | Visual and dimensional check before packing; final gate before shipment |
SUPERB Automation Acceptance Guarantee
Every board that passes the above tests is backed by full traceability. We maintain a zero‑defect policy for critical parameters (open/short, hole copper thickness, solderability). A complete inspection report including microsection photos, e‑test logs, and dimensional data is available upon request.
Every board that passes the above tests is backed by full traceability. We maintain a zero‑defect policy for critical parameters (open/short, hole copper thickness, solderability). A complete inspection report including microsection photos, e‑test logs, and dimensional data is available upon request.
Reference: IPC-6012 Class 2/3 · Test methods per IPC-TM-650 · All inspections performed on statistically sampled lots or 100% where required.
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Superb Automation Co., Limited
Website:www.superb-tech.com
For 25 years your reliable partner in Electronics & PCBA!
HK number: 85260404363
Email :Info@superb-tech.com
Whatsapp:8613396081443