These compact 1X4 chips feature topside G-S-G pads making them very easy to integrate in 4-channel pluggable transceivers. They utilize a top-illuminated design with optical (illumination) aperture diameter of 20 μm and a 250 μm pitch spacing.

Key Features

• Die-level self-hermetic

• Responds to 1260 nm to 1620 nm

• Low capacitance of 80 fF

• Low dark current and high reliability

• Operating temperature -40 °C to 85 °C

• Designed to GR-468 for use in non-hermetic packages

• Top anode and backside cathode configuration