Our high-speed EML chip delivers excellent bandwidth and optical signal quality for high-speed datacom links. These high-performance, high-reliability devices are engineered and qualified for cost-effective non-hermetic packaging.

Key Features

• Available alternatives: 112 Gb/s (56 GBd PAM4 modulation) or 224 Gb/s (112 GBd PAM4 modulation)
• Available wavelengths: CWDM
• Compatible with cost-effective non-hermetic packaging
• Operating temperature 50-60 °C
• Integrated RF termination resistor provides for superior signal integrity