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PartNo:
ADI ADS1015IDGSR
Mfg:
ADI ADS1015IDGSR
D/C:
Qty:
Packing:
Description:
Design & Preparation
PCB Design: Engineers create schematics and layouts using tools like Altium Designer, defining component placement and signal paths. Gerber files guide PCB fabrication 
Component Procurement: Sourcing resistors, ICs, connectors, etc., based on BOM (Bill of Materials). Strict incoming inspection includes:
Electrical testing and visual checks 
Pre-processing (e.g., baking moisture-sensitive chips) 
 
SMT (Surface Mount Technology) Assembly
For small components (e.g., resistors, ICs):
 
Solder Paste Printing:
Apply solder paste via stencil; SPI (Solder Paste Inspection) verifies thickness/coverage 
Component Placement:
High-speed pick-and-place machines position parts (±0.05mm precision) 
Reflow Soldering:
Controlled heating (preheat → melt → cool) forms permanent solder joints 
Automated Optical Inspection (AOI):
Scans for defects like misalignment or solder bridges 
 
THT (Through-Hole Technology) Assembly
For larger components (e.g., connectors, capacitors):
Manual/Automated Insertion:
Pins inserted into PCB holes 
Wave Soldering:
Board passes molten solder wave; parameters (time/temperature) prevent damage 
Post-Process:
Cut Leads: Trim excess pins.
Hand Soldering: Touch-up for complex parts.
Cleaning: Remove flux residues 
 
Testing & Quality Assurance
Critical for functional validation:
ICT (In-Circuit Test): Checks component values and connections 
FCT (Functional Test): Powers up the board; simulates real operation (e.g., input/output verification) 
Environmental Testing:
Aging (burn-in), vibration, temperature cycling 
X-Ray Inspection: For hidden joints (e.g., BGA chips) 
 
Conformal Coating & Final Assembly
Conformal Coating: Spray polymer layer (e.g., silicone) for moisture/dust resistance 8.
Integration: Mount PCBA into enclosures; connect peripherals 
Final Check: Power-on test and packaging for shipment 

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