As power control systems evolve toward higher efficiency, miniaturization, and intelligence, HDI TR power control board PCBs have become essential enablers of next-generation designs.

Built with TU876 copper-clad laminate and constructed in a 10-layer design at just 1.0mm thickness, this PCB incorporates High-Density Interconnect (HDI) technology to achieve ultra-fine circuitry and superior integration without compromising electrical performance.

Leveraging advanced laser drilling and precision component placement, the board delivers exceptional thermal management, robust signal integrity, and reliable power control—making it ideal for high-demand applications.