10-Layer 2nd-Generation HDI Rigid-Flex PCB: Advanced Solution for High-Density and High-Performance Applications

This innovative rigid-flex PCB combines 10-layer construction with 2nd-generation HDI technology to deliver superior signal integrity, miniaturization, and reliability in demanding environments. Ideal for 5G communications, automotive systems, aerospace, and medical devices such as CT scanners, it offers an optimal balance of flexibility, durability, and electrical performance.

Key Features:

• 10-Layer Design: Supports complex circuits and high component density, saving space without compromising performance.

• 2nd-Generation HDI: Implements micro-vias and fine-pitch components for higher connection density and improved signal transmission.

• Impedance Control: Ensures precise matching for high-speed and high-frequency signals.

• Resin Plugging: Enhances mechanical strength and electrical isolation in challenging conditions.

• Miniaturization: Enables compact, lightweight designs with high component density.

• Low Signal Loss: Optimized layout and materials to maintain signal quality in data-intensive applications.

• High-Frequency Operation: Supports frequencies up to several GHz with low noise and distortion.

• Thermal Management: Designed for efficient heat dissipation in continuous-operation devices.

• Customizable Design: Tailored stacking, materials, and microvia options to meet specific requirements.

Design & Manufacturing Excellence:

• Utilizes high-frequency materials (e.g., PTFE, Rogers) for reduced signal loss.

• DFM (Design for Manufacturability) optimized to ensure production efficiency and quality.

• Suitable for automated assembly, with considerations for component orientation and test points.

• Built to operate reliably in harsh environmental conditions.

As a leading manufacturer of advanced rigid-flex PCBs, we provide cutting-edge solutions that meet the stringent demands of modern high-performance electronic systems.