6-layer high-frequency hybrid laminated PCB with metal edges is an exceptional choice in the field of electronics.

① It combines multiple materials such as Rogers RO4350B, S1000-2M, FR-4, and TG170 through composite lamination, offering both low loss and high stability, and delivers outstanding performance in high-frequency signal processing.

② The metal-edged structure not only enhances mechanical protection but also effectively shields against electromagnetic interference, ensuring stable signal transmission.

③ The ENIG surface treatment provides excellent corrosion resistance and solderability, guaranteeing reliable component connections.

④ With high manufacturing precision, a minimum via size of 0.25mm, and a minimum trace width/spacing of 5/5mil, it supports high-density wiring and significantly improves circuit integration.

⑤ Strict impedance control combined with 35μm inner and outer copper thickness enables efficient signal transmission and stable power supply.

Manufactured through a single lamination and drilling process, the technology is mature and stable. Whether in 5G communications, aerospace, or automotive electronics, it provides a solid and reliable circuit foundation for products and enhances overall performance.