Format: 8 - Layer - Multilayer

Material: FR4 Tg 150 (Special Layer Construction)

Surface: chemical gold 2U

Min Track / Space: 100μm

Min. Drill Dia.: 0.2mm

Soldermask: Top + Bottom, green

Marking Print: without

E-Test: Yes

Layer buildup: Custom

Impedance control: Yes, 10% tolerance

Blind Vias: Yes