PCB Manufacturing Specifications
PCB Production Solution for Industrial IO Module
What kind of PCB can we make?
Our PCB manufacturing services cover diverse types, meeting the requirements of different industries and applications
| By Structure | |
| Standard | 2-68 layer PCB, Rigid PCB, Flexible PCB, Rigid-Flex PCB |
| Specialized | Heavy Copper PCB, HDI PCB |
| High Frequency | |
| Types | High-Frequency PCB, RF PCB, Microwave PCB, High-Frequency Hybrid PCB, Rogers PCB, Teflon PCB, PTFE PCB |
| By Function | |
| Standard | Embedded PCB, Metal Core PCB, Bare PCB, PCB Prototype, Custom PCB, Quick Turn PCB, Through-Hole PCB, Multilayer PCB |
| Advanced | Any-Layer HDI PCB, High Tg PCB, High-Speed PCB, FR4 PCB, IC Carrier PCB, Rigid-Flexible PCB |
| By Technology | |
| Via Technologies | Blind Via PCB, Microvia PCB, VIP PCB, Half-Hole PCB |
| Special Processes | Metal Edged PCB, Controlled Depth Drilled PCB, Metalized Blind Slot PCB, Countersink PCB, Gold Finger PCB, Impedance Control PCB |
| By Surface Finish | |
| Gold Finishes | Gold Immersion PCB, Electrolytic Gold PCB, Nickel-Palladium Gold PCB, Immersion Gold + OSP PCB, Immersion Gold + Electrolytic Gold PCB |
| Alternative Finishes | Immersion Tin PCB, Immersion Silver PCB, Leaded Solder PCB, Lead-Free Solder PCB |
Layers
1-68
Max Size
600×1200mm
Min Trace
4mil
Copper
1-8oz
Core Parameters
This PCB is designed for industrial IO module applications, requiring high reliability, signal integrity, and mechanical stability in harsh environments.
| Parameter | Specification | Purpose |
|---|---|---|
| Substrate | FR4 (High Tg) | Stable dielectric performance for industrial temperature range |
| PCB Thickness | 1.600mm | Meet mechanical assembly and warpage tolerance |
| Surface Finish | Immersion Gold | Enable fine-pitch component soldering and anti-oxidation |
| Stencil Thickness | 0.1mm | Optimize solder paste release for dense component layout |
| Solder Paste Thickness (BOT) | 0.125mm | 0.025mm thicker than stencil for robust solder joints |
| CBA Thickness | 1.600mm | Controlled board assembly thickness for mechanical fit |
Design Scheme
Structure & Function
- Multi-layer design integrating industrial IO interfaces, power management circuits, and signal conditioning modules
- Signal integrity optimization for analog/digital mixed-signal paths (controlled impedance, reduced crosstalk)
- Power plane layout with dedicated GND/VCC layers for stable power delivery to high-current components
- Mechanical robustness design with edge stiffeners and precise mounting hole tolerances
Drilling & Routing Requirements
- High-density via array (microvias and through-holes) for multi-layer interconnection, total holes >500
- Precision Control: ±0.05mm hole position accuracy, 0.2mm minimum drill diameter
- Trace width/spacing: 6/6mil for signal lines, 10/10mil for power lines
Design Documentation
Production Process
1
Multi-Layer Lamination
- • FR4 core + prepreg layers laminated to 1.6mm
- • Precise layer alignment (<±0.03mm) for inter-layer vias
- • Thermal curing optimized for Tg stability
- • Controlled pressure (25-30 kgf/cm²) during lamination
2
Immersion Gold Finish (7-Step Process)
1.Degreasing: Remove organic contaminants (50-60℃, 5min)
2.Micro-etching: Roughen copper surface (1-2min)
3.Activation: Deposit palladium catalyst (3-5min)
4.Nickel plating: 5-10μm layer (pH 4.5-5.5, 80-85℃)
5.Gold replacement: 2-3μm layer (pH 8.5-9.5, 70-75℃)
6.Post-cleaning: Remove residual salts (3min)
7.Drying: Hot air drying (60-70℃, 5min) – prevent oxidation
3
SMT Assembly
- • 0.1mm stencil with laser-cut apertures
- • 0.125mm solder paste thickness (BOT side)
- • Reflow profile: Preheat (150-170℃/60s)
- • Reflow profile: Soak (170-190℃/40s)
- • Reflow profile: Peak (235-245℃/10s)
- • Post-reflow inspection: X-ray + AOI
Immersion Gold Process Key Notes
Nickel layer thickness >5μm to avoid "black pad" defect
Gold layer optimized to 2-3μm for cost vs. performance balance
Post-cleaning uses 18MΩ deionized water to remove residues
Meets IPC-6012 class 2 requirements for industrial applications
Quality Control
In-Process Inspection
✓
After drilling
X-ray inspection + CMM measurement (verify hole position, diameter, and plating integrity)
✓
After etching
AOI (inspect trace width/spacing, shorts, opens, and copper uniformity)
✓
After immersion gold
XRF (gold/nickel layer thickness); solderability test (wetting balance method)
Final Verification
✓
Electrical Tests
Bed-of-Nails test (continuity, insulation resistance); impedance test (controlled impedance lines)
✓
Reliability Tests
Thermal cycling: -40℃~+85℃, 1000 cycles
Humidity test: 85℃/85%RH, 500h
Mechanical shock: 50G, 11ms
Summary
The production of MultiLayer PCB ensures reliability for industrial applications through:
- Design: Prioritizing "mixed-signal integrity + power delivery stability" for industrial IO scenarios
- Manufacturing: Controlling "multi-layer lamination precision, 7-step immersion gold process (5-10μm nickel + 2-3μm gold), and SMT process parameters"
- QC: Full-process inspection covering drilling, etching, plating, and final electrical/reliability verification