NVMe/SAS Drive Backplane PCBA High-performance PCB assembly for artificial intelligence and HPC workloads — GPU accelerators, AI server motherboards, switch backplanes, OAM/SXM modules, and chiplet interconnect substrates. 20–78 layer boards with Megtron 6 / IT-968G low-loss materials, 112 Gbps PAM4 signaling, and dense BGA assembly down to 0.5 mm pitch. Every board undergoes 3D X-ray, boundary scan, and thermal cycling validation for hyperscale data center reliability.
RF & Wireless Communication PCBA RF & Wireless Communication PCBA turnkey assembly by Superb Automation. 6-layer hybrid PCB (Rogers RO4350B + FR4), ENIG finish, 400MHz–6GHz frequency range. Fully assembled with RF transceiver, PA, LNA, SAW/BAW filters, FPGA/SoC — SMT SAC305, selective conformal coating, multi-cavity RF shielding.