SawFilter-FR4
PCB Production Solution
Core Parameters
This PCB is designed for RF filtering applications requiring high signal integrity and reliable soldering performance.
| Parameter | Specification | Purpose |
|---|---|---|
| Substrate | FR4 | Low high-frequency loss, stable dielectric performance |
| PCB Thickness | 1.600mm | Meet mechanical assembly tolerance |
| Surface Finish | Immersion Gold | Enable fine-pitch soldering and high-frequency transmission |
| Stencil Thickness | 0.1mm | Optimize solder paste release for BGA components |
| Solder Paste Thickness | 0.125mm | 0.025mm thicker than stencil for reliable joints |
| CBA Thickness | 1.600mm | Controlled board assembly thickness |
Design Scheme
Structure & Function
- Circular design integrating Saw Filter circuits, 12Vdc power modules, and passive components
- High-frequency signal integrity (control impedance/parasitics around Saw Filter)
- Thermal/EMC management (ensure copper foil adhesion in large-area regions)
- Mechanical precision (match assembly tolerances for edge positioning holes)
Drilling Requirements
- 321 holes total (multiple PTH/NPTH round holes: 0.5mm, 1mm, 3.5mm, etc.)
- Precision Control: ±0.05mm accuracy via CCD alignment + smart drill bit switching
Design Documentation
Production Process
1
Substrate & Circuit
- • FR4 lamination to 1.6mm
- • Ensure interlayer alignment
- • Dry film lithography + etching
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2
Immersion Gold
- • 2-3μm gold layer thickness
- • Anti-oxidation properties
- • Ideal for fine-pitch soldering
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3
SMT Process
- • 0.1mm stencil design
- • 0.125mm solder paste thickness
- • Custom reflow profile
Quality Control
In-Process Inspection
✓
After drilling
X-ray inspection + aperture measurement (verify hole accuracy, PTH plating integrity)
✓
After etching
AOI (inspect line width, shorts, opens)
✓
After immersion gold
XRF (gold layer thickness); wettability test (solderability)
Final Verification
✓
Electrical Tests
Impedance/conductivity tests (power/Saw Filter signal paths)
✓
Reliability Tests
Thermal shock: -40℃~+125℃, 500 cycles
Damp heat aging: 85℃/85%RH, 1000h
Summary
Production success relies on:
- Design: Prioritizing "high-frequency signal integrity + thermal management"
- Manufacturing: Controlling "drilling precision, immersion gold quality, SMT process"
- QC: Full-process quality control to ensure reliability — demonstrating our capabilities in precision PCB manufacturing