Format: 8 - Layer - Multilayer

Size: 306,00mm x 313,00mm = 9,58dm2

Material: FR4 Tg 150 1.55mm OL:70μm / IL:70μm Cu

Surface: galv. hard gold 30U

Min Track / Space: 150μm

Min. Drill Dia.: 0.2mm

Solderstop: without

Marking Print: without

E-Test: Yes

Blind Vias: Yes

Filled & Capped Via: IPC 4761 Type VII

IPC class 3: Yes