Precision Manufacturing and Superior Quality

From engineering design (DFM) to final delivery, our production and testing processes are fully digitalized for end-to-end monitoring. With advanced process technology and comprehensive testing methods, we provide solid quality assurance for your products from prototyping to mass production.

For more information, please contact us at: pcb@superb-tech.com

PCB Process & Testing Workflow

We’ve organized the production process into 6 core stages based on manufacturing logic, making it easier to understand the full lifecycle of PCB production and quality control.

Stage 1: Pre-Production Preparation

Lay the foundation for manufacturing by verifying design feasibility and defining process parameters.

Process Name	Main Purpose	Instruments & Processes
Pre-production Engineering	Review design documents and determine process parameters	1. Manual review of design documents to confirm compliance with manufacturing capabilities 2. CAM (Computer-Aided Manufacturing) software to check the integrity and accuracy of design data (e.g., line width, hole position, layer alignment)

Stage 2: Inner Layer Circuit Fabrication

Create precise inner-layer circuits, the core conductive layer of multi-layer PCBs.

Process Name	Main Purpose	Instruments & Processes
Inner Layer Imaging	Accurately transfer circuit patterns onto inner-layer copper-clad boards	AOI (Automated Optical Inspection) equipment: Compare with standard patterns to verify: - Integrity of circuit patterns - Accuracy of line width and line spacing - Absence of missing lines or short circuits
Etching	Remove unnecessary copper foil to form precise inner-layer circuits	1. AOI equipment: Detect over-etching/under-etching and neatness of circuit edges 2. Metallographic microscope: Observe cross-sections to confirm copper layer thickness meets requirements
Photoresist Stripping	Completely remove residual photoresist from inner-layer circuits	1. Visual inspection (or with a magnifying glass) 2. Confirm no photoresist residue remains on circuit surfaces (residue may affect subsequent lamination)
Inspection & Post-Etch Punch	Inspect inner-layer circuit quality and complete positioning holes	1. AOI equipment: Recheck for circuit defects (e.g., open circuits, short circuits) 2. Hole diameter measuring instrument: Verify hole size accuracy 3. Coordinate measuring instrument: Check hole position precision (ensures alignment with other layers)
Alternative Oxide Coating	Form a uniform anti-oxidation coating on copper layer surfaces	1. Film thickness gauge: Measure coating thickness (ensures uniformity) 2. Surface roughness tester: Detect coating surface roughness (optimizes adhesion for lamination)

Stage 3: Lamination & Drilling

Bond multi-layer materials and drill holes for inter-layer connection.

Process Name	Main Purpose	Instruments & Processes
Lamination	Press multi-layer board materials together under high temperature and pressure	1. X-ray inspection equipment: Detect internal air bubbles and inter-layer alignment (prevents delamination) 2. Hardness tester: Measure board hardness (ensures structural stability)
Drilling	Drill vias (for inter-layer conduction) and mounting holes per design requirements	1. Hole diameter measuring instrument: Verify hole size accuracy 2. Hole position measuring instrument: Check hole position precision 3. Microscope: Observe hole wall quality (e.g., no burrs, no delamination)

Stage 4: Outer Layer Circuit Fabrication

Complete outer-layer circuits and ensure electrical conduction between layers.

Process Name	Main Purpose	Instruments & Processes
Metallization of the Dielectric	Deposit a metal layer on hole walls and insulating surfaces to achieve electrical conduction	1. Metallographic microscope: Observe thickness and uniformity of the hole-wall metal layer 2. Micro-ohmmeter: Measure resistance of the hole metal layer (ensures low-resistance conduction)
Outer Layer Imaging	Accurately transfer outer-layer circuit patterns onto the board surface	AOI equipment: Check: - Accuracy of pattern transfer - Integrity of outer-layer circuits - Alignment with inner layers
Copper Plating	Uniformly plate a copper layer on the board surface and in holes	1. Film thickness gauge: Measure copper plating thickness (ensures conductivity and durability) 2. Hull cell test: Evaluate plating solution performance (indirectly reflects copper plating quality)
Photoresist Stripping (Outer Layer)	Remove photoresist used in outer-layer circuit fabrication	Visual inspection (or with a magnifying glass): Confirm no photoresist residue on outer-layer circuits
Final Etching	Precisely etch to form the final outer-layer circuit	1. AOI equipment: Check for short circuits, open circuits, and etching quality 2. Metallographic microscope: Observe circuit cross-section size (ensures compliance with design specifications)
Tin Stripping	Remove the protective tin layer on circuits	Visual inspection: Confirm complete removal of the tin layer (residue may affect solder mask application)

Stage 5: Surface Treatment & Marking

Protect circuits, improve solderability, and add identification marks.

Process Name	Main Purpose	Instruments & Processes
Solder Mask Application	Accurately apply a solder mask layer and expose pads	1. AOI equipment: Check: - Coverage of the solder mask layer (no missing areas) - Accurate exposure of pads (prevents solder mask from covering pads) 2. Film thickness gauge: Measure solder mask thickness (ensures insulation and durability)
Surface Finish	Improve circuit surface solderability and anti-oxidation performance	1. Film thickness gauge: Measure the thickness of the surface treatment layer (e.g., ENIG, HASL) 2. Contact angle measuring instrument: Detect surface wettability (ensures good solderability)
Silkscreen	Print clear characters, logos, or part numbers	1. Visual inspection: Check clarity and integrity of characters/logos 2. Magnifying glass: Verify neatness of silkscreen pattern edges (no smudging or blurring)

Stage 6: Electrical Test & Shaping

Verify electrical performance and cut boards into finished products.

Process Name	Main Purpose	Instruments & Processes
Electrical Test	Detect PCB electrical performance	1. Flying probe tester (for small-batch/prototype): Detect open circuits, short circuits, insulation resistance, and impedance 2. Bed-of-nails tester (for mass production): High-speed testing of electrical parameters (ensures no functional defects)
Routing & V-Scoring	Cut boards into individual finished products or machine V-grooves (for easy separation)	1. Calipers: Measure the size of cut boards (ensures compliance with design dimensions) 2. Microscope: Check cut edge quality (no burrs or damage to circuits)

Why Choose Our PCB Manufacturing?

• Full Digital Monitoring: Every process is tracked digitally, ensuring traceability of quality data.
• Multi-Level Quality Checks: AOI, microscopic inspection, and electrical testing are integrated into each stage to avoid defects.
• Professional Equipment: Advanced instruments (e.g., X-ray inspection, flying probe testers) guarantee precision.

For customized PCB solutions or technical consultations, contact us at pcb@superb-tech.com!