Rigid-Flex / Flex PCB Fabrication Rigid-flex PCB manufacturing — 14 layers · 10 rigid + 4 flex · 2+2 split · 2.2 mm · Panasonic · 3 mil line · Lead-free HASL · Build-to-print from Gerber files
20L Hybrid PCB — PTFE+FR4, Embedded R, Blind | Superb Automation Hybrid PCB manufacturing — PTFE+FR4 · 20 layers · 5.7 mm · 4-step blind via · Blind slot · Embedded resistors · Back drill · Build-to-print from Gerber files
2-Layer High-Frequency Microwave PCB High-frequency microwave PCB on PTFE laminate. 2 layers, 0.127–5.0 mm thickness range, 1 × 3 mm minimum board size. Microwave transmission line width tolerance ± 0.015 mm. Full-board ENIG soft gold plus localized thick gold 2 μm. Planar resistor integration and laser cutting.
18-Layer High-Speed Multilayer PCB — Panasonic M6, 64Gbps, 20:1 Aspect Ratio High-speed digital PCB with 18 layers on Panasonic M6 (R-5775) laminate. 4.0 mm finished thickness, 0.20 mm minimum drill at 20:1 aspect ratio. Double-sided back-drilling with stub < 0.08 mm. Differential impedance control ±7.5% (≤ 50 Ω) and ±5% (> 50 Ω). 64 Gbps NRZ/PAM4 signaling capability.
IC Substrate Manufacturer-Bond BGA Package Substrate High-precision IC carrier board with 132 Au wire-bond fingers, 144 solder ball pads, and center die-attach thermal pad — achieving CPK 4.08 on gold finger width.
10-Layer 2.60mm HD Multimedia Main Control PCB 2.60 mm Thick · 4/4 mil Trace/Space · 0.20mm Micro-Via at 12.8 Aspect Ratio · High-Coverage ENIG · Double-Sided High-Density BGA · Case Study: 10-Layer Multimedia Development Board
10-Layer High-Precision Multilayer Main Control PCB 10-layer high-precision multilayer main control PCB: 1.60mm, 4/4 mil, ENIG, high-density BGA. Build-to-print from Gerber files. Full DFM, symmetrical lamination. RFQ
8-Layer Optical Fiber Transmission PCB 2.60 mm Thick · 4/5 mil Trace/Space · ENIG · 0.19 mm Micro-Via · Case Study: 10G Optical Fiber Transmission Board
6-Layer High-Speed Communication PCB 483.61 × 279.15 mm · 4/4 mil Trace/Space · ENIG · Full DFM Report · Case Study: dm6446-v3.0-0331-2
4-Layer Industrial Control PCB — 4× DDR Top/Bottom Mount, 167.64×111.15 mm, 4/4 mil, ENIG 4-layer industrial control PCB: 4× DDR top/bottom, 167.64×111.15mm, 4/4 mil, ENIG. DFM verified, impedance controlled. Prototype to volume
6 layer UltraThin HDI Camera Board 6-layer ultra-thin HDI camera board by Superb Automation. 0.6mm finished thickness, 3/3mil trace/space, 4mil laser blind vias, ENIG finish, FR4 Tg≥150°C substrate. Optimized for MIPI D-PHY/C-PHY at 2.5Gbps/lane with <0.2dB/mm insertion loss at 3GHz.
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