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SuperB bring 25 years of component supply and 10 years of PCB & PCBA manufacturing together under one roof. From your first drawing to the finished product in a box — design, parts sourcing, PCB fabrication, assembly, box build, and testing — we handle it all.
Industries: Medical · 5G Communications · Industrial · IoT · Automotive · Radar → One partner, full chain: Design → Parts → PCB → PCBA → Box Build → Testing → 5,000 m² cleanroom, 7 SMT lines → No MOQ · Fast prototypes · On-time delivery
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The XCR3128XL-10TQG144C from XILINX is a FPGA programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.
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Learn MoreThe XC95144XL-5TQG144C from XILINX is a FPGA programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.
Learn MoreThe XC3550AN-4TQG144C from XILINX is a FPGA programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.
Learn MoreThe XC3550-4TQG144C from XILINX is a FPGA programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.
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The XC3S400-4FGG456C from XILINX is a Spartan-3 programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.
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The XC3S1400A-4FTG256C from XILINX is a Spartan-3 programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.
Learn MoreThe XC3S1200E-5FTG256C from XILINX is a Spartan-3 programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.
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6-layer ultra-thin HDI camera board by Superb Automation. 0.6mm finished thickness, 3/3mil trace/space, 4mil laser blind vias, ENIG finish, FR4 Tg≥150°C substrate. Optimized for MIPI D-PHY/C-PHY at 2.5Gbps/lane with <0.2dB/mm insertion loss at 3GHz.
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18-Layer 2nd-Order HDI · 2oz Thick Copper · TU883 · 2.6mm · ENIG; High-Current Power Distribution Backplane
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RF & Wireless Communication PCBA turnkey assembly by Superb Automation. 6-layer hybrid PCB (Rogers RO4350B + FR4), ENIG finish, 400MHz–6GHz frequency range. Fully assembled with RF transceiver, PA, LNA, SAW/BAW filters, FPGA/SoC — SMT SAC305, selective conformal coating, multi-cavity RF shielding.
Learn MoreComponent Brands We are authorized to distribute and source original parts from the world's leading semiconductor manufacturers.
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