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SuperB bring 25 years of component supply and 10 years of PCB & PCBA manufacturing together under one roof. From your first drawing to the finished product in a box — design, parts sourcing, PCB fabrication, assembly, box build, and testing — we handle it all.
Industries: Medical · 5G Communications · Industrial · IoT · Automotive · Radar → One partner, full chain: Design → Parts → PCB → PCBA → Box Build → Testing → 5,000 m² cleanroom, 7 SMT lines → No MOQ · Fast prototypes · On-time delivery
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The AD9361BBCZ is a high-performance, highly integrated 2×2 RF Agile Transceiver (2 transmit, 2 receive channels) from Analog Devices. It combines an RF front end with flexible mixed-signal baseband processing in a single 144-ball CSP-BGA package. Operating from 47MHz to 6GHz, it supports both TDD and FDD systems with 12-bit DACs and ADCs, programmable bandwidth from 200 kHz to 56 MHz, automatic gain control, and RSSI measurement. Superb Automation partners with leading brands including Qorvo, TI, ADI, XILINX, NVIDIA, Intel, ST, MACOM, Renesas, and Coilcraft.
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The AD9364BBCZ is a high-performance, highly integrated 1×1 RF Agile Transceiver from Analog Devices. Operating from 70 MHz to 6 GHz, it covers most licensed and unlicensed bands — making it suitable for software-defined radio (SDR), cellular base stations, point-to-point microwave links, UAV video downlinks, and test and measurement equipment. The device combines an RF front end, a flexible mixed-signal baseband section, frequency synthesizers, two 12-bit ADCs, and two 12-bit DACs — all in a 144-ball CSP-BGA package (0.8 mm pitch). It interfaces to a baseband processor through a parallel CMOS or LVDS digital port. Built-in self-calibration and automatic gain control (AGC) maintain consistent performance across temperature and signal conditions. Superb Automation partners with leading brands including Analog Devices, Texas Instruments, Xilinx, Intel, Qorvo, MACOM, NVIDIA, and more — providing in-stock availability, competitive pricing, and worldwide shipping.
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The TMS320F28335PGFA is a high-performance 32-bit digital signal controller (DSC) from Texas Instruments' C2000™ Delfino™ family. Built on a 150 MHz C28x CPU with an integrated hardware IEEE-754 single-precision Floating-Point Unit (FPU), it delivers 150 MIPS of real-time processing throughput for closed-loop control applications. The device packs 512 KB of on-chip Flash memory and 68 KB of RAM, a 16-channel 12-bit ADC with 80 ns conversion time, 18 PWM outputs (6 with high-resolution 150 ps micro-step control), and a rich peripheral set including CAN 2.0B, SPI, I2C, SCI/UART, McBSP, and a 16/32-bit External Memory Interface (EMIF). Housed in a compact 176-pin LQFP (24×24 mm) package and rated for the full industrial temperature range (−40°C to +85°C), the TMS320F28335PGFA is engineered for demanding motor drives, digital power conversion, renewable energy systems, and advanced industrial automation.
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CGHV96100F2 is a high-performance RF power transistor from Wolfspeed (Cree). Designed for RF and microwave applications, it operates up to 960 MHz with high output power, high efficiency, and rugged construction — well-suited for telecommunications, radar systems, and industrial/scientific/medical (ISM) applications. Built on gallium nitride (GaN) on silicon carbide (SiC) substrate technology, it delivers superior power density and thermal management.
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CREE CGHV96050F2 - RF & Microwave.Application:SATCOM, 5G mmWave, Phased-Array Radar, EW/Defense, Point-to-Point Radio, RF Test
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CREE CGHV96050F2-AMP - RF & Microwave.Application:SATCOM, 5G mmWave, Phased-Array Radar, EW/Defense, Point-to-Point Radio, RF Test
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Qorvo QPM1000 - RF & Microwave.Application:SATCOM, 5G mmWave, Phased-Array Radar, EW/Defense, Point-to-Point Radio, RF Test
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The XCV50-5FG256I from XILINX is a FPGA programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing applications.
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Rigid-flex PCB manufacturing — 14 layers · 10 rigid + 4 flex · 2+2 split · 2.2 mm · Panasonic · 3 mil line · Lead-free HASL · Build-to-print from Gerber files
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Hybrid PCB manufacturing — PTFE+FR4 · 20 layers · 5.7 mm · 4-step blind via · Blind slot · Embedded resistors · Back drill · Build-to-print from Gerber files
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High-frequency microwave PCB on PTFE laminate. 2 layers, 0.127–5.0 mm thickness range, 1 × 3 mm minimum board size. Microwave transmission line width tolerance ± 0.015 mm. Full-board ENIG soft gold plus localized thick gold 2 μm. Planar resistor integration and laser cutting.
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High-speed digital PCB with 18 layers on Panasonic M6 (R-5775) laminate. 4.0 mm finished thickness, 0.20 mm minimum drill at 20:1 aspect ratio. Double-sided back-drilling with stub < 0.08 mm. Differential impedance control ±7.5% (≤ 50 Ω) and ±5% (> 50 Ω). 64 Gbps NRZ/PAM4 signaling capability.
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High-precision IC carrier board with 132 Au wire-bond fingers, 144 solder ball pads, and center die-attach thermal pad — achieving CPK 4.08 on gold finger width.
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10-layer high-precision multilayer main control PCB: 1.60mm, 4/4 mil, ENIG, high-density BGA. Build-to-print from Gerber files. Full DFM, symmetrical lamination. RFQ
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2.60 mm Thick · 4/5 mil Trace/Space · ENIG · 0.19 mm Micro-Via · Case Study: 10G Optical Fiber Transmission Board
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483.61 × 279.15 mm · 4/4 mil Trace/Space · ENIG · Full DFM Report · Case Study: dm6446-v3.0-0331-2
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5G RU Radio Unit Board PCBA. 5G PCBA, BBU Baseband, RRU Remote Radio, AAU Active Antenna, DU/CU, O-RAN, UPF Core, OTN Optical, WDM/DWDM, PTP Grandmaster, N
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RF & Wireless Communication PCBA turnkey assembly by Superb Automation. 6-layer hybrid PCB (Rogers RO4350B + FR4), ENIG finish, 400MHz–6GHz frequency range. Fully assembled with RF transceiver, PA, LNA, SAW/BAW filters, FPGA/SoC — SMT SAC305, selective conformal coating, multi-cavity RF shielding.
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Panasonic MEGTRON6 R-5775 is a high-speed, low-loss multilayer laminate designed for next-generation RF and high-frequency digital applications. With a dielectric constant (Dk) of approximately 3.5 and a dissipation factor (Df) of 0.004 at 1 GHz, R-5775 offers a balance of signal integrity and thermal reliability that makes it a preferred substrate for 5G base station transceivers, millimeter-wave radar, high-speed network switches, and advanced driver-assistance system (ADAS) processing boards. Superb Automation fabricates PCBs on R-5775 and comparable high-frequency laminates from customer Gerber and stackup files. Material is procured per the customer's specification — the laminate choice drives the fabrication process parameters, not the other way around.
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The traction inverter is the single most power-dense electronic assembly in an electric vehicle. It converts DC battery voltage to three-phase AC to drive the motor — switching hundreds of amps at hundreds of volts, tens of thousands of times per second. A single solder joint defect on a power stage PCB can cascade into field failure, warranty recall, or safety incident. This guide covers the six factors procurement teams should evaluate when selecting an inverter PCBA supplier: copper weight and current handling, substrate and thermal management, power semiconductor assembly, cleanliness and partial discharge, test and validation, and traceability.
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Advanced HDI (High-Density Interconnect) extends beyond standard multi-layer PCB fabrication by incorporating laser-drilled micro-vias, sequential lamination build-up layers, and fine-line trace/space geometries below 4/4 mil. Where a standard through-hole multilayer board connects every layer with mechanically drilled vias that span the entire board thickness, HDI uses blind and buried micro-vias that connect only the layers they need to — freeing routing space on other layers and enabling denser component placement. At Superb Automation, advanced HDI PCBs are fabricated to customer Gerber and stackup files. The fabrication process — micro-via laser drilling, sequential lamination registration, fine-line LDI imaging and etching — is tuned per build based on the customer's via stack definition and design rules.
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