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SuperB bring 25 years of component supply and 10 years of PCB & PCBA manufacturing together under one roof. From your first drawing to the finished product in a box — design, parts sourcing, PCB fabrication, assembly, box build, and testing — we handle it all.
Industries: Medical · 5G Communications · Industrial · IoT · Automotive · Radar → One partner, full chain: Design → Parts → PCB → PCBA → Box Build → Testing → 5,000 m² cleanroom, 7 SMT lines → No MOQ · Fast prototypes · On-time delivery
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The XC7A100T-2FGG484C is a mid-range Artix-7 FPGA from AMD Xilinx, built on 28nm HPL process technology. With 101,440 logic cells, 240 DSP slices, 4.86 Mb block RAM, and 4 GTX transceivers supporting up to 10.3 Gb/s, it delivers excellent fabric density and I/O bandwidth in a compact 484-FCBGA package. The -2 speed grade provides mid-range performance, and the commercial temperature range (0C to +85C) covers most indoor and lab-based applications.
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The XC7A200T-2FBG484I is the largest Artix-7 FPGA from AMD Xilinx, built on 28nm HPL process technology. With 215,360 logic cells, 740 DSP slices (929 GMAC/s), 13.14 Mb block RAM, and 4 GTX transceivers supporting up to 10.3 Gb/s, it delivers unmatched fabric density in its class. The industrial temperature range (-40C to +100C TJ) and -2 speed grade make it ideal for SDR platforms, machine vision, embedded computing, and high-performance industrial control systems.
Learn MoreSuperb Automation Standard Product · 9.0–9.5 GHz · 1000W Peak (60 dBm) · Pulsed · WR90 Waveguide · RS485 · GaN HEMT Class AB
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The AD9363BBCZ is a high-performance 2×2 RF Agile Transceiver™ purpose-built for 3G and 4G femtocell base stations. It combines best-in-class receiver sensitivity (−122dBm), ultralow transmitter EVM (−34dB), and a highly integrated direct-conversion architecture spanning 325MHz to 3.8GHz. With SPI + UART control, RSSI, and AGC, it delivers carrier-grade small-cell performance — also popular in PlutoSDR and open-source SDR platforms.
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The AD9361BBCZ is a high-performance, highly integrated 2×2 RF Agile Transceiver (2 transmit, 2 receive channels) from Analog Devices. It combines an RF front end with flexible mixed-signal baseband processing in a single 144-ball CSP-BGA package. Operating from 47MHz to 6GHz, it supports both TDD and FDD systems with 12-bit DACs and ADCs, programmable bandwidth from 200 kHz to 56 MHz, automatic gain control, and RSSI measurement. Superb Automation partners with leading brands including Qorvo, TI, ADI, XILINX, NVIDIA, Intel, ST, MACOM, Renesas, and Coilcraft.
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The AD9364BBCZ is a high-performance, highly integrated 1×1 RF Agile Transceiver from Analog Devices. Operating from 70 MHz to 6 GHz, it covers most licensed and unlicensed bands — making it suitable for software-defined radio (SDR), cellular base stations, point-to-point microwave links, UAV video downlinks, and test and measurement equipment. The device combines an RF front end, a flexible mixed-signal baseband section, frequency synthesizers, two 12-bit ADCs, and two 12-bit DACs — all in a 144-ball CSP-BGA package (0.8 mm pitch). It interfaces to a baseband processor through a parallel CMOS or LVDS digital port. Built-in self-calibration and automatic gain control (AGC) maintain consistent performance across temperature and signal conditions. Superb Automation partners with leading brands including Analog Devices, Texas Instruments, Xilinx, Intel, Qorvo, MACOM, NVIDIA, and more — providing in-stock availability, competitive pricing, and worldwide shipping.
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The TMS320F28335PGFA is a high-performance 32-bit digital signal controller (DSC) from Texas Instruments' C2000™ Delfino™ family. Built on a 150 MHz C28x CPU with an integrated hardware IEEE-754 single-precision Floating-Point Unit (FPU), it delivers 150 MIPS of real-time processing throughput for closed-loop control applications. The device packs 512 KB of on-chip Flash memory and 68 KB of RAM, a 16-channel 12-bit ADC with 80 ns conversion time, 18 PWM outputs (6 with high-resolution 150 ps micro-step control), and a rich peripheral set including CAN 2.0B, SPI, I2C, SCI/UART, McBSP, and a 16/32-bit External Memory Interface (EMIF). Housed in a compact 176-pin LQFP (24×24 mm) package and rated for the full industrial temperature range (−40°C to +85°C), the TMS320F28335PGFA is engineered for demanding motor drives, digital power conversion, renewable energy systems, and advanced industrial automation.
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CGHV96100F2 is a high-performance RF power transistor from Wolfspeed (Cree). Designed for RF and microwave applications, it operates up to 960 MHz with high output power, high efficiency, and rugged construction — well-suited for telecommunications, radar systems, and industrial/scientific/medical (ISM) applications. Built on gallium nitride (GaN) on silicon carbide (SiC) substrate technology, it delivers superior power density and thermal management.
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60,000 Pins | SFP+ · Interlaken · QPI · PCIe3 · DDR4 · DDR3 | TU872SLK-sp | Intel Platform Loss Spec | 1-Month Turnaround
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Lattice CPLD + TI FPGA · 4 Bottom-Plate Connectors · 3× Differential · Mid-Board Cutouts · 10–14 Layers · Superb Automation
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6–8 Layer · DDR3L · Dual GbE · 10× COM · PCIe 16X · LVDS · mSATA/mPCIe · 8× USB · High-Density Layout · Superb Automation
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Rigid-flex PCB manufacturing — 14 layers · 10 rigid + 4 flex · 2+2 split · 2.2 mm · Panasonic · 3 mil line · Lead-free HASL · Build-to-print from Gerber files
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Heavy copper PCB manufacturing — 16 layers · 5 oz inner copper · 3.75 mm · Press-fit ±0.05 mm · Resin plug · Blind via · Build-to-print from Gerber files
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Hybrid PCB manufacturing — PTFE+FR4 · 20 layers · 5.7 mm · 4-step blind via · Blind slot · Embedded resistors · Back drill · Build-to-print from Gerber files
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High-frequency microwave PCB on PTFE laminate. 2 layers, 0.127–5.0 mm thickness range, 1 × 3 mm minimum board size. Microwave transmission line width tolerance ± 0.015 mm. Full-board ENIG soft gold plus localized thick gold 2 μm. Planar resistor integration and laser cutting.
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High-speed digital PCB with 18 layers on Panasonic M6 (R-5775) laminate. 4.0 mm finished thickness, 0.20 mm minimum drill at 20:1 aspect ratio. Double-sided back-drilling with stub < 0.08 mm. Differential impedance control ±7.5% (≤ 50 Ω) and ±5% (> 50 Ω). 64 Gbps NRZ/PAM4 signaling capability.
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512-Channel Neural Signal Acquisition | Intan RHD Chipset · FPGA Processing | USB 3.0 · 30 kHz/ch | Low-Noise Analog Front-End | Open Ephys Compatible The electrophysiology data acquisition (DAQ) board is a high-density mixed-signal PCB that digitizes microvolt-level neural signals from up to 512 channels simultaneously and streams them to a host computer over USB 3.0. Compatible with the Open Ephys open-source platform, this board integrates Intan RHD-series bioamplifier chips, an FPGA for data aggregation and protocol handling, USB 3.0 PHY, and DDR memory — all on a single high-layer-count PCB. Superb Automation provides turnkey PCBA for these neuroscience research instruments, with the precision analog handling and signal isolation that µV-level recording demands.
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FPV video transmitters (VTX) are the critical RF link between the drone and the pilot's goggles or ground station. Superb Automation provides PCBA assembly for VTX modules across all common FPV frequency bands — from the popular 5.8 GHz band (up to 8W output) to long-range 1.2/1.3 GHz, mid-range 2.4 GHz, and specialty 3.3 GHz and 1.5/1.6 GHz bands. Our RF PCB assembly process addresses the unique challenges of high-power RF design: thermal management, impedance control, EMI shielding, and SMA connector mechanical integrity.
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F405 V1/V2 · F722 8S | STM32F405 / STM32F722 | ICM42688 / MPU6000 Gyro | DJI Ready | Betaflight / INAV | 3-8S Lipo Flight controllers are the central processing unit of any FPV drone — integrating the MCU, gyroscope, barometer, OSD chip, BEC regulators, and interface connectors on a single compact PCB. Superb Automation provides complete turnkey PCBA for the F405 and F722 flight controller families, covering component procurement, SMT assembly, gyro calibration, firmware flashing, and functional testing.
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5G RU Radio Unit Board PCBA. 5G PCBA, BBU Baseband, RRU Remote Radio, AAU Active Antenna, DU/CU, O-RAN, UPF Core, OTN Optical, WDM/DWDM, PTP Grandmaster, N
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RF & Wireless Communication PCBA turnkey assembly by Superb Automation. 6-layer hybrid PCB (Rogers RO4350B + FR4), ENIG finish, 400MHz–6GHz frequency range. Fully assembled with RF transceiver, PA, LNA, SAW/BAW filters, FPGA/SoC — SMT SAC305, selective conformal coating, multi-cavity RF shielding.
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Panasonic MEGTRON6 R-5775 is a high-speed, low-loss multilayer laminate designed for next-generation RF and high-frequency digital applications. With a dielectric constant (Dk) of approximately 3.5 and a dissipation factor (Df) of 0.004 at 1 GHz, R-5775 offers a balance of signal integrity and thermal reliability that makes it a preferred substrate for 5G base station transceivers, millimeter-wave radar, high-speed network switches, and advanced driver-assistance system (ADAS) processing boards. Superb Automation fabricates PCBs on R-5775 and comparable high-frequency laminates from customer Gerber and stackup files. Material is procured per the customer's specification — the laminate choice drives the fabrication process parameters, not the other way around.
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The traction inverter is the single most power-dense electronic assembly in an electric vehicle. It converts DC battery voltage to three-phase AC to drive the motor — switching hundreds of amps at hundreds of volts, tens of thousands of times per second. A single solder joint defect on a power stage PCB can cascade into field failure, warranty recall, or safety incident. This guide covers the six factors procurement teams should evaluate when selecting an inverter PCBA supplier: copper weight and current handling, substrate and thermal management, power semiconductor assembly, cleanliness and partial discharge, test and validation, and traceability.
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Advanced HDI (High-Density Interconnect) extends beyond standard multi-layer PCB fabrication by incorporating laser-drilled micro-vias, sequential lamination build-up layers, and fine-line trace/space geometries below 4/4 mil. Where a standard through-hole multilayer board connects every layer with mechanically drilled vias that span the entire board thickness, HDI uses blind and buried micro-vias that connect only the layers they need to — freeing routing space on other layers and enabling denser component placement. At Superb Automation, advanced HDI PCBs are fabricated to customer Gerber and stackup files. The fabrication process — micro-via laser drilling, sequential lamination registration, fine-line LDI imaging and etching — is tuned per build based on the customer's via stack definition and design rules.
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