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SMT Assembly & Product Integration
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SuperB bring 25 years of component supply and 10 years of PCB & PCBA manufacturing together under one roof. From your first drawing to the finished product in a box — design, parts sourcing, PCB fabrication, assembly, box build, and testing — we handle it all.
Industries: Medical · 5G Communications · Industrial · IoT · Automotive · Radar → One partner, full chain: Design → Parts → PCB → PCBA → Box Build → Testing → 5,000 m² cleanroom, 7 SMT lines → No MOQ · Fast prototypes · On-time delivery
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The LC76GABMD is Quectel's multi-GNSS positioning module based on the AG3352 chipset, supporting concurrent reception of GPS, GLONASS, BeiDou, Galileo, and QZSS in the L1 band. With -166dBm tracking sensitivity and 28s cold-start time-to-first-fix, it delivers robust, reliable positioning even in weak-signal environments. The compact LCC-28 package (9.7 x 10.1mm) and UART/I2C interfaces make it easy to integrate, while pin-compatibility with the earlier L76 and L76-LB modules enables seamless migration. It is the ideal GNSS engine for IoT asset tracking, wearables, vehicle navigation, and industrial positioning applications.
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The 6V49205BNLGI is Renesas (formerly IDT) application-specific clock generator purpose-built for Freescale/NXP QorIQ P1010, P1020, P2020, and P2040 communications processors. It converts a single low-cost 25MHz crystal into 19 high-quality, low-jitter output clocks — processor clock, DDR memory clock, and peripheral clocks — with selectable DDR frequency and a maximum output of 125MHz. This eliminates the need for multiple discrete oscillators, reducing BOM cost and simplifying clock tree design in QorIQ-based networking, telecom, and embedded systems. The compact 48-VFQFPN (7x7mm) package and industrial -40C to +85C range make it the definitive timing solution for QorIQ platforms.
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The MT40A512M16JY-083E IT:B is Micron's 8Gb DDR4 SDRAM organized as 512M words x 16 bits, delivering 2400 MT/s (DDR4-2400) data transfer at a low 1.2V supply. As a fourth-generation double data rate synchronous DRAM, it offers higher bandwidth, lower power, and improved reliability over DDR3L — the current standard for new embedded designs. The industrial temperature grade (-40C to +95C) ensures reliable operation in outdoor, automotive, and industrial equipment where commercial-grade memory would fail. The 96-ball FBGA x16 package enables dense multi-chip memory arrays for embedded computing, networking equipment, FPGA processing boards, and industrial controllers.
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The AT45DB041E-SSHN2B-T is Adesto's 4Mbit DataFlash serial NOR Flash, built on a proprietary dual SRAM buffer architecture that makes it the most efficient memory for data logging and event recording. Unlike standard NOR Flash, DataFlash lets the host program one SRAM buffer while simultaneously reading or erasing from the other — enabling continuous, gap-free data capture at 85MHz SPI clock. With 2048 pages x 256 bytes organization, 1.65V to 3.6V wide supply, and an 8-SOIC narrow package, it is ideal for IoT data loggers, industrial event recording, metering, and code shadowing applications where uninterrupted data streaming is essential. Request Quo
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The MC33PF8100EAES is NXP's 12-channel power management IC (PMIC) purpose-built for high-performance processing applications. Integrating 7 buck regulators and 4 LDOs, it delivers complete power management for NXP i.MX8 and S32x application processors from a single 5V input. OTP pre-programmed with the exact voltage levels, power-up sequencing, and fault handling required by the target processor, it eliminates external sequencing and simplifies board design. AEC-Q100 automotive qualification, -40C to +125C operation, and the compact QFN-56 package make it the definitive power solution for automotive infotainment, digital clusters, telematics, vehicle networking, ADAS, and vision/sensor fusion systems.
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The LTC7150SEY#PBF is Analog Devices' 20V, 20A synchronous step-down DC-DC regulator featuring second-generation Silent Switcher 2 technology. It integrates the hot-loop bypass capacitors inside the package to minimize EMI radiation, enabling clean, compact high-current power delivery without complex external filtering. Accepting 3.1V to 20V input with 0.6V to 5.5V adjustable output, programmable switching from 400kHz to 3MHz, current-mode control, and integrated power MOSFETs, it is the definitive high-current point-of-load solution for FPGA/ASIC core rails, server processors, and high-density computing power supplies. The BGA-42 package delivers low thermal resistance and short internal connections for exceptional power density.
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The CMPA901A035F is Wolfspeed's 35W GaN MMIC power amplifier for X-band (9-10GHz) applications, built on a gallium nitride (GaN) high-electron-mobility transistor (HEMT) monolithic microwave integrated circuit grown on a silicon carbide (SiC) substrate. The SiC substrate's superior thermal conductivity enables high power density with efficient heat dissipation, while the flange-mount package provides direct heatsink attachment for high-power radar and communication transmitters. Operating from a 28V supply with high gain and efficiency across the 9-11GHz instantaneous bandwidth, it is the amplifier of choice for X-band pulsed radar, marine weather radar, military radar, electronic warfare, and satellite communication uplink systems.
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The STM32F407VET6 belongs to ST's STM32F407 series — the connectivity-enhanced variant of the legendary F405 family. The on-chip Ethernet 10/100 MAC with dedicated DMA enables direct IP connectivity for MAVLink-over-UDP ground control links — eliminating external SPI-to-Ethernet bridge ICs. The DCMI (Digital Camera Interface) supports 8–14 bit parallel camera sensors for onboard optical flow, visual odometry, and AI-assisted landing target detection. With the same Cortex-M4F core at 168 MHz and hardware FPU, it delivers the same deterministic flight control performance as the Pixhawk-class F405 while adding key peripherals for advanced drone applications: IP-connected ground stations, camera-based navigation, and distributed UAV network architectures. STM32F407 — the connectivity-focused sibling of the F405, adding Ethernet 10/100 MAC and DCMI camera interface for advanced drone applications including IP-based ground control links and onboard computer vision.
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Advanced Multi-Layer BGA Package Substrate for CPU, Power Module and Processor IC Applications. With the rapid development of semiconductor technology, traditional PCB solutions cannot meet the requirements of high-density chip packaging. IC Package Substrate has become a critical connection platform between semiconductor dies and main PCB systems.
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Heavy copper PCB manufacturing — 16 layers · 5 oz inner copper · 3.75 mm · Press-fit ±0.05 mm · Resin plug · Blind via · Build-to-print from Gerber files
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60,000 Pins | SFP+ · Interlaken · QPI · PCIe3 · DDR4 · DDR3 | TU872SLK-sp | Intel Platform Loss Spec | 1-Month Turnaround
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Lattice CPLD + TI FPGA · 4 Bottom-Plate Connectors · 3× Differential · Mid-Board Cutouts · 10–14 Layers · Superb Automation
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6–8 Layer · DDR3L · Dual GbE · 10× COM · PCIe 16X · LVDS · mSATA/mPCIe · 8× USB · High-Density Layout · Superb Automation
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Rigid-flex PCB manufacturing — 14 layers · 10 rigid + 4 flex · 2+2 split · 2.2 mm · Panasonic · 3 mil line · Lead-free HASL · Build-to-print from Gerber files
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Hybrid PCB manufacturing — PTFE+FR4 · 20 layers · 5.7 mm · 4-step blind via · Blind slot · Embedded resistors · Back drill · Build-to-print from Gerber files
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High-frequency microwave PCB on PTFE laminate. 2 layers, 0.127–5.0 mm thickness range, 1 × 3 mm minimum board size. Microwave transmission line width tolerance ± 0.015 mm. Full-board ENIG soft gold plus localized thick gold 2 μm. Planar resistor integration and laser cutting.
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RF Transceiver Board PCBA. RF PCBA, Power Amplifier, LNA, RF Front-End, Phased Array, Beamforming, Antenna Array, Frequency Synthesizer, Rogers PCB
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512-Channel Neural Signal Acquisition | Intan RHD Chipset · FPGA Processing | USB 3.0 · 30 kHz/ch | Low-Noise Analog Front-End | Open Ephys Compatible The electrophysiology data acquisition (DAQ) board is a high-density mixed-signal PCB that digitizes microvolt-level neural signals from up to 512 channels simultaneously and streams them to a host computer over USB 3.0. Compatible with the Open Ephys open-source platform, this board integrates Intan RHD-series bioamplifier chips, an FPGA for data aggregation and protocol handling, USB 3.0 PHY, and DDR memory — all on a single high-layer-count PCB. Superb Automation provides turnkey PCBA for these neuroscience research instruments, with the precision analog handling and signal isolation that µV-level recording demands.
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FPV video transmitters (VTX) are the critical RF link between the drone and the pilot's goggles or ground station. Superb Automation provides PCBA assembly for VTX modules across all common FPV frequency bands — from the popular 5.8 GHz band (up to 8W output) to long-range 1.2/1.3 GHz, mid-range 2.4 GHz, and specialty 3.3 GHz and 1.5/1.6 GHz bands. Our RF PCB assembly process addresses the unique challenges of high-power RF design: thermal management, impedance control, EMI shielding, and SMA connector mechanical integrity.
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F405 V1/V2 · F722 8S | STM32F405 / STM32F722 | ICM42688 / MPU6000 Gyro | DJI Ready | Betaflight / INAV | 3-8S Lipo Flight controllers are the central processing unit of any FPV drone — integrating the MCU, gyroscope, barometer, OSD chip, BEC regulators, and interface connectors on a single compact PCB. Superb Automation provides complete turnkey PCBA for the F405 and F722 flight controller families, covering component procurement, SMT assembly, gyro calibration, firmware flashing, and functional testing.
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5G RU Radio Unit Board PCBA. 5G PCBA, BBU Baseband, RRU Remote Radio, AAU Active Antenna, DU/CU, O-RAN, UPF Core, OTN Optical, WDM/DWDM, PTP Grandmaster, N
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RF & Wireless Communication PCBA turnkey assembly by Superb Automation. 6-layer hybrid PCB (Rogers RO4350B + FR4), ENIG finish, 400MHz–6GHz frequency range. Fully assembled with RF transceiver, PA, LNA, SAW/BAW filters, FPGA/SoC — SMT SAC305, selective conformal coating, multi-cavity RF shielding.
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He built IoT smart home devices in France. He'd been cheated by a supplier. He still chose to trust a rookie. Fifteen years later, they're still talking about roses.
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